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Chemical Vapor Deposition of Graphene on Cu-Ni Alloys: The Impact of Carbon Solubility

机译:石墨烯对Cu-Ni合金的化学气相沉积:碳溶解度的影响

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Chemical vapour deposition (CVD) is the most promising graphene synthesis route for film and electronic applications but the growth mechanism is still not fully understood. Herein, we investigate the role of the solubility of carbon in the underlying growth substrate on the CVD growth of graphene. A range of Cu-Ni alloys compositions that cover the carbon (C) solubility range between low C solubility (pure Cu) and high C solubility (pure Ni) were used as the catalytic growth substrates. The CVD of graphene on Cu-Ni alloys showed a transition from bilayer graphene (BLG) to few-layer graphene (FLG) at a substrate Ni concentration of 45 wt.%, which was attributed to an increase in the bulk diffusion of C. The Cu-rich alloys had a high graphene coverage (BLG) at a fast-cooling rate (367 °C/min), while the Ni-rich alloys had a low coverage (FLG) under the same cooling condition. In contrast, at slow cooling rates (27 °C/min), the Cu-rich alloys had a low coverage of graphene (BLG) and the Ni-rich alloys had a high coverage of graphene (FLG). Glow discharge optical emission spectroscopy (GDOES) was used to profile the subsurface composition, particularly the C concentration, as a function of depth.
机译:化学气相沉积(CVD)是薄膜和电子应用的最有前景的石墨烯合成途径,但仍然不完全理解生长机制。在此,我们研究了碳溶解度在石墨烯CVD生长上的潜在生长基质中的作用。使用覆盖低C溶解度(纯Cu)和高C溶解度(纯Ni)之间的碳(C)溶解度范围的一系列Cu-Ni合金组合物作为催化生长底物。 Cu-Ni合金上的石墨烯的CVD显示在45重量%的底物Ni浓度下从双层石墨烯(BLG)到几层石墨烯(FLG)的转变,其归因于C的散装扩散的增加​​。 Cu的合金以快速冷却速率(367℃/ min)具有高石墨烯覆盖(BLG),而Ni的合金在相同的冷却条件下具有低覆盖率(FLG)。相反,在缓慢的冷却速率(27℃/ min)下,Cu的合金具有低覆盖石墨烯(BLG),并且Ni的合金具有高覆盖石墨烯(FLG)。辉光放电光发射光谱(GDOES)用于以深度的函数来分析地下组合物,特别是C浓度。

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