Investigation of Thick-Film-Paste Rheology and Film Material for Pattern Transfer Printing (PTP) Technology

摘要

Steady cost pressure in silicon solar cell production leads to a continuous reduction of silver consumption per cell. Pattern Transfer Printing (PTP) technology enables to reduce silver consumption by depositing smaller front electrodes on solar cells. Here, we aim at a better understanding of the laser deposition process. The aspect ratio of printed lines improved with increasing paste yield stress but was lower than the theoretical aspect ratio for a given trench geometry, suggesting that line spreading was caused by the pressure that was due to the vaporization of volatile paste components and a yield stress reduction that was due to local paste heating. A low laser power threshold, mandatory to fabricate narrow electrodes with a high aspect ratio and low amount of debris, could be achieved using pastes with low boiling temperature of volatile components and poor wetting between paste and film. The material with the lowest light transmission exhibited the lowest laser power threshold. We attribute this to the weaker adhesion to the paste and a better alignment with the laser focal plane. Our results provide valuable guidelines for paste and film material design aimed at narrower electrodes, with a higher aspect ratio to be obtained at an even lower laser power threshold in PTP-based solar cell metallization.