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首页> 外文期刊>PLoS One >Microbial corrosion of DSS 2205 in an acidic chloride environment under continuous flow
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Microbial corrosion of DSS 2205 in an acidic chloride environment under continuous flow

机译:DSS 2205在连续流动下酸性氯化物环境中的微生物腐蚀

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摘要

Corrosion under flow conditions is a major problem in the transportation industry. Various studies have shown the direct impact of different flow rates on bacteria biofilm formation, mass transfer and resulting different corrosion behaviour of materials in neutral environments. However, little is understood on corrosion under acidic flow conditions. This study investigated the impact of an acidic artificial seawater environment containing Desulfovibrio vulgaris on DSS 2205 microbial corrosion under different velocities (0.25 m.s -1 and 0.61 m.s -1 ). Experiments containing no bacteria were performed as controls. Bacterial attachment was observed by optical and scanning electron microscope (SEM). Materials corrosion was assessed using open circuit potential (OCP), electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization. Pits formed after potentiodynamic test were observed under SEM. The largest area of bacterial attachment was found on coupons immersed at a velocity of 0.25 m.s -1 ; however, the corrosion rate was lower than at higher velocity. Shallow pits occurred in the metal coupons when bacteria were present, while deep pits occurred in the controls. The study indicates the positive impact of biofilm formation in corrosion prevention of materials under acidic condition. The nature of corrosion behaviour of duplex stainless is discussed.
机译:流动条件下的腐蚀是运输业的主要问题。各种研究表明,不同流量对细菌生物膜形成,传质和中性环境中材料的不同腐蚀行为的直接影响。然而,在酸性流动条件下腐蚀很少看出。本研究研究了不同速度下DSS 2205微生物腐蚀的酸性人工海水环境对DSS 2205微生物腐蚀的影响(0.25m,0.25m,0.61m -1)。不含细菌的实验作为对照进行。通过光学和扫描电子显微镜(SEM)观察细菌附着。使用开路电位(OCP),电化学阻抗光谱(EIS)和电位辐射极化来评估材料腐蚀。在SEM下观察到电位动力学测试后形成的凹坑。在浸没在0.25mm的速度下的优惠券上发现了最大的细菌附着区域;然而,腐蚀速率低于较高速度。当存在细菌时,金属优惠券中发生浅坑,而在控制中发生深坑。该研究表明生物膜形成在酸性条件下腐蚀防止材料的积极影响。讨论了双相不锈钢腐蚀行为的性质。

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