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Electrical and morphological characterization of zinc-doped α- Fe 2O 3 thin films at different annealing temperature

机译:锌掺杂α-Fe 2 O 3 薄膜不同的薄膜退火温度

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α Fe2O3is naturally n-type material. Zn was used to dope α-Fe2O3(Zn: Fe2O3) to turn it into p-type. The thin film of Zn: Fe2O3was obtained by spin coating a blend of Zinc acetate (Zn (CH3COO)22H2O) and FeCl2after annealing the film in air. Zn-doped-Fe2O3was found as a p-type semiconductor by Hall Measurement. Effect of annealing at 450°C and 550°C temperature on electrical properties were also investigated. The resistivity of those films was found to be between 1 and 10?-m. It was observed that the resistivity of the films increases with increasing temperature for most of the sample. It was also observed that the resistivity of the film is inversely proportional to the increasing number of film layer and thickness within most of the sample. Atomic Force Microscopy (AFM) was used to observe the surface morphology of the annealed film on glass substrate. The variation of the average roughness of annealed film on the glass substrate was from 60nm to 98nm and the thickness was 160nm to 540nm.
机译:αFe2O3是天然n型材料。 Zn用于掺杂α-Fe 2 O 3(Zn:Fe 2 O 3)将其变成p型。通过旋涂乙酸锌(Zn(CH3COO)22H2O)和FECL2在空气中退火的FE2O3Was而获得的Zn:Fe 2 O 3瓦斯。 Zn-Doped-Fe2O3与霍尔测量的P型半导体发现。还研究了450℃和550℃的电气性能下退火的影响。发现这些薄膜的电阻率在1到10°之间。观察到薄膜的电阻率随着大部分样品的温度的增加而增加。还观察到,薄膜的电阻率与大部分样品中的薄膜层和厚度的越来越多的薄膜层和厚度成反比。原子力显微镜(AFM)用于观察玻璃基材上退火膜的表面形态。玻璃基板上退火膜的平均粗糙度的变化为60nm至98nm,厚度为160nm至540nm。

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