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Wetting and brazing of YIG ceramics using Ag–CuO–TiO 2 metal filler

机译:使用Ag-Cuo-TiO 金属填料

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The wetting and brazing of Y3Fe5O12(YIG) ceramics with a Ag–8CuO–2TiO2filler was investigated for the first time. For comparison, the wettability of a Ag–10CuO filler on YIG ceramics was similarly investigated. The Ag–8CuO–2TiO2filler has an equilibrium contact angle of approximately 31?°C on the YIG substrate at 1000?°C; thus, its wettability is excellent. Moreover, its wettability exceeds that of Ag–10CuO. The microstructure and the interfacial structure between the filler and the substrate were determined using scanning electron microscopy, X-ray diffraction, EPMA and transmission electron microscopy. The liquid Ag–8CuO–2TiO2filler can react with the YIG substrate by forming continuous Y2Ti2O7layers with dotted CuFe2O4and promote the wetting behavior and bonding performance. The average shear strength could exceed 30?MPa for the joints at a brazing temperature of 1000?°C. As rupture occurred adjacent to the seam at the ceramic side, the strengths of the interfaces were characterized via nanoindentation. The hardness of the interface with doped TiO2exceeds that of Ag–10CuO, which is strengthened by the dotted CuFe2O4among Y2Ti2O7.
机译:第一次研究了Y3Fe5O12(YIG)陶瓷的润湿和钎焊剂,第一次研究了AG-8Cuo-2TiO2填充剂。为了比较,同样研究了Ag-10Cuo填料的润湿性。 Ag-8Cuo-2TiO2填充剂在1000Ω℃下在YIG基板上具有约31Ω℃的平衡接触角;因此,其润湿性是优异的。此外,其润湿性超过Ag-10Cuo。使用扫描电子显微镜,X射线衍射,EPMA和透射电子显微镜测定填料和基板之间的微观结构和界面结构。液体Ag-8CuO-2TiO2填充剂可以通过用点缀Cufe2O4形成连续的Y2Ti2O7镶嵌和促进润湿行为和粘合性能,使液体Ag-8Cuo-2TiO 2填充剂与Yig底物反应。平均剪切强度可超过30°MPa的接头,其钎焊温度为1000Ω·℃。由于在陶瓷侧的接缝附近发生破裂,通过纳米凸缘的界面的强度表征。掺杂TiO2的界面的硬度为Ag-10Cuo,由虚线Cufe2O4among Y2Ti2O7加强。

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