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Study on the Key Factors of Efficient and Stable WEDM

机译:高效稳定WEDM的关键因素研究

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In this paper, firstly, the microscopic discharging conditions of reciprocated-WEDM (also known as HS-WEDM) are studied, based on the picture data that recoded by 30000 frame/s high-speed camera. The research shows that the instable and inefficient cutting of HS-WEDM is mainly due to the big discharging chips and badly chips removal conditions in the discharging channels. In order to solve these problems, based on nanosecond pulse and microsecond pulse superimposed discharging strategy, a double-frequency power supply with current limiting inductance is designed. And then particle size distribution tests are carried out. The experiments prove that the size of the discharging chips can be reduced, within the discharging process of the double-frequency power supply. And smaller chips are helpful for the chips removal. Finally, by using dielectric with better encapsulation and inclusive, the cutting efficiency of the HS-WEDM with double-frequency power is higher than 350mm2/min. The results show that the cutting efficiency mainly depend on the size of the chips and chip removal ability in the discharging channel. And the double-frequency power supply with current limiting inductance in this paper obviously improves the WEDM efficiency.
机译:在本文中,基于由30000帧/秒的高速相机重新编码的图像数据,研究了往复式-WEDM的微观放电条件(也称为HS-WEDM)。该研究表明,HS-WEDM的不稳定和低效切割主要是由于放电芯片的大放电芯片,并且放电通道中的碎片去除条件严重。为了解决这些问题,基于纳秒脉冲和微秒脉冲叠加放电策略,设计了一种具有限流电感的双频电源。然后进行粒度分布测试。实验证明,可以在双频电源的放电过程内降低放电芯片的尺寸。较小的芯片有助于芯片去除。最后,通过使用更好的封装和包容性的电介质,具有双频功率的HS-WEDM的切削效率高于350mm2 / min。结果表明,切削效率主要取决于芯片中芯片和芯片去除能力的尺寸。本文采用电流限制电感的双频电源明显提高了WEDM效率。

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