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Qualification of a system technology for selective laser-based quasi-simultaneous soldering with an integrated pyrometric process control

机译:具有集成高温过程控制的选择性激光基准焊接系统技术的资格

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Due to the tendency of miniaturization of electronic components, the increased use of thermally sensitive circuit boards e.g. LCDs, a large number of requirements arises for a selective laser beam soldering process. To enhance the possibilities of selective soldering, a system technology for quasi-simultaneous, pyrometric controlled laser soldering was qualified. The systems capability is to enable a controlled laser soldering process at different spot-sizes, varying electronic device layouts and different irradiation strategies. An inline emission measurement via pyrometer gains live-data from the soldering process, evaluates them and transfers them in a closed loop cycle to the laser power control. To enable a process control over a large scanning field, a chromatic corrected f-theta optic, which compensates the chromatic aberration between laser and pyrometer wavelength was used. Different scanning strategies and varying laser power profiles have been evaluated regarding their influence on the process quality.
机译:由于电子元件的小型化趋势,增加了热敏电路板的使用。 LCD,为选择性激光束焊接过程产生大量要求。为提高选择性焊接的可能性,用于准同质的高温控制激光焊接的系统技术。系统能力是在不同的光斑尺寸,不同的电子设备布局和不同的照射策略中启用受控激光焊接过程。通过高温计获得来自焊接过程的现场数据的内联排放测量,评估它们并将它们传送到闭环周期中以激光功率控制。为了使过程控制能够通过大扫描场,使用校正F-θ光学器,其补偿激光和高温计波长之间的色差。已经评估了不同的扫描策略和不同的激光功率曲线关于它们对过程质量的影响。

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