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Design of process parameters for the manufacturing of wrapped connections with single solid round wires using the explicit finite element analysis

机译:使用明确的有限元分析制造与单个固体圆线的包装连接的工艺参数的设计

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The importance of simulation has grown significantly in recent years and, in addition to its application in product and process planning, it is increasingly used in all planning and implementation phases as well as in the optimization of existing systems. The solderless wrapping process is a highly reliable electrical connection technology. A wrapped connection is a gas-tight, mechanically, and electrically durable pressure connection and often exhibits a lower probability of failure under vibration load compared to soldered connections. Appropriate material selection and correct execution of the wrapping process are prerequisites. In order to achieve these, an exact knowledge of the wire behavior and the design of the process parameters is necessary. In this paper, the wrapping process is simulated using a finite element simulation. In the first step, the relevant parameters are identified by a cause-effect analysis and then integrated into the modeling. The validation of the model is carried out by comparing geometric parameters of the connection and the resulting mechanical stresses of simulation and experiment. The model can be used to simulate a wrapped connection with an accuracy of approximately 95 %. The model is suitable for varying process parameters and investigating their influence on the quality of the connection.
机译:近年来,模拟的重要性显着发展,除了在产品和过程规划中的应用外,还越来越多地用于所有规划和实施阶段以及在现有系统的优化中。无焊接包装过程是一种高度可靠的电气连接技术。包裹的连接是气密,机械和电耐压连接,与焊接连接相比,振动载荷通常在振动负荷下表现出较低的概率。适当的材料选择和正确执行包装过程是先决条件。为了实现这些,需要精确地了解电线行为和工艺参数的设计。在本文中,使用有限元模拟模拟包装过程。在第一步中,通过原因效应分析识别相关参数,然后集成到建模中。通过比较连接的几何参数以及产生的模拟和实验的机械应力来执行模型的验证。该模型可用于模拟缠绕的连接,精度约为95%。该模型适用于不同的工艺参数,并调查它们对连接质量的影响。

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