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Electronic Multiscale Hybrid Materials: Sinter-Free Inks, Printed Transparent Grids, and Soft Devices

机译:电子多尺度混合材料:无烧结墨水,印刷透明网格和软设备

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摘要

Hybrid electronic materials combine the excellent electronic properties of metals and semiconductors with the mechanical flexibility, ease of processing, and optical transparency of polymers. This talk will discuss hybrids that combine organic and inorganic components at different scales. Metallic and semiconductor nanoparticle cores are coated with conductive polymer shells to create “hybrid inks” that can be inkjet-printed and form conductive leads without any sintering step. Transparent electrodes are printed using ultrathin metal nanowires with core diameters below 2 nm. The chemically synthesized wires spontaneously form percolating structures when patterned with a soft stamp; this rapidly yields optically transparent grid electrodes, even on demanding soft substrates. These new hybrid electronic materials enable the fabrication of soft electronics, including flexible sensors on polymer foils, radio-frequency identification (RFID) antennae on cardboard, and soft human–machine interfaces. Selected devices will be covered at the end of the talk.
机译:混合电子材料将金属和半导体的优异电子性质与机械柔韧性,易于加工和聚合物的光学透明度相结合。这次谈话将讨论将有机和无机成分在不同尺度上结合的杂种。金属和半导体纳米粒子芯涂有导电聚合物壳,以创造“杂交液体墨水;这可以是喷墨印刷的,并且没有任何烧结步骤的导电引线。使用超薄金属纳米线印刷透明电极,芯直径低于2nm。在用柔软的印记图案时,化学合成的电线自发地形成渗透结构;即使在要求柔软的基材上,这也快速产生光学透明的电网电极。这些新的混合电子材料能够制造软电子器件,包括柔性传感器在聚合物箔上,纸板上的射频识别(RFID)天线和软人和Ndash;机器界面。所选设备将在谈话结束时介绍。

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