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首页> 外文期刊>Frontiers in Mechanical Engineering >An Experimental and TheoreticalStudy of the Impact of the PrecursorPulse Time on the Growth Per Cycleand Crystallinity Quality of TiO2 ThinFilms Grown by ALD and PEALDTechnique
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An Experimental and TheoreticalStudy of the Impact of the PrecursorPulse Time on the Growth Per Cycleand Crystallinity Quality of TiO2 ThinFilms Grown by ALD and PEALDTechnique

机译:铝和孔径生长的TiO2薄薄岩血液结晶度质量对生长的实验和理论研究

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摘要

In this paper, theoretical and experimental approaches were used to evaluate the impactof the precursor’s pulse time on the growth per cycle and the crystallinity quality ofatomic layer deposited TiO2 thin films on Si(100) and FTO substrates. We employ ageneral model that can be applied to both metal and oxidant precursors, based onthe Maxwell-Boltzmann velocity distribution from which the molecular flux of gasesthat collide with the substrate is deduced to adjust the experimental characteristics ofgrowth per cycle vs. pulse time. This model allowed us to adjust the growth per cycleof TiO2 films produced by thermal atomic layer deposition and by plasma-enhancedatomic layer deposition under different deposition parameters and substrates. Theinfluence of growth per cycle on the chemical and structural properties of TiO2 thinfilms was evaluated by Rutherford backscattering spectroscopy, grazing incidence xray diffraction, and ellipsometry techniques. In thermal mode, using H2O as an oxidantprecursor, the stoichiometry of TiOx films has an x value of 1.98 from the growth percycle saturated regardless of the metal precursor or substrate used. Using O2 plasma,a super-stoichiometric film with x values from 2.02 to 2.30 was obtained. In thermalmode, the growth per cycle saturated and film thickness are, on average, 40% higherfor TiCl4 compared to TTIP precursor. Using O2 plasma, the growth per cycle saturatedis approximately twice as high as the thermal mode using the TTIP precursor. For bothatomic layer deposition modes, the degree of crystallinity showed values of 50–80% forTiCl4 in the temperature range of 250–350?C. For TTIP, it was below 40% in thermalmode and between 80 and 95% in plasma mode (250?C). It was observed that thereaction rate, the diffusion coefficient, and the molecular flux are inversely proportionalto the temperature. These results provide evidence that the crystallinity and epitaxialquality of the TiO2 film are higher for TTIP using O2 plasma. However, we verified that there was better stability of the parameters analyzed for TiCl4 in the two atomic layerdeposition modes.
机译:在本文中,理论和实验方法用于评估前体脉冲时间对每周期生长的影响,结晶度质量沉积在Si(100)和FTO基材上的TiO2薄膜。我们采用可以应用于金属和氧化剂前体的ageneral模型,基于Maxwell-Boltzmann速度分布,从中推导出与底物的循环碰撞的分子通量调节每周期的生长的实验特性与脉冲时间。该模型使我们允许我们在不同沉积参数和基板下通过热原子层沉积和等离子体增强层沉积来调节每循环产生的TiO 2膜的增长。通过Rutherford反向散射光谱法评估每周期对TiO2薄薄膜的化学和结构性质的Theinfluupe对TiO2薄膜的化学和结构性质进行评估,放牧入射X射线衍射和椭圆形技术。在热模式下,使用H 2 O作为氧化剂重生,TiOx膜的化学计量从生长百含物的X值为1.98,无论使用的金属前体或基板如何。使用O 2等离子体,得到了从2.02至2.30的具有X值的超级化学计量膜。在热插导中,与TTIP前体相比,每循环饱和和膜厚度的生长饱和和膜厚度高出40%。使用O2等离子体,每循环饱和的生长约用TTIP前体的热模式大约是热模式的两倍。对于脱垂层沉积模式,结晶度的程度显示在250-350℃的温度范围内的50-80%FortIC14的值。对于TTIP,热插拔低于40%,等离子体模式(250℃)的80至95%之间。观察到终点,扩散系数和分子通量对温度成反比。这些结果提供了证据表明,使用O 2血浆的TTIP,TiO 2膜的结晶度和外延性较高。然而,我们验证了在两个原子层置位模式中对TiCL4分析的参数具有更好的稳定性。

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