Thermal Design, Analysis and Packaging of an Airborne Multi-output Power Supply Unit

摘要

Design of airborne multi-output power supply unit (MOPS) is restricted by space, weight and predefined geometry of air flow path. The unit is cooled by ram air and hence, exposed to the extreme external thermal environment that changes typically from +55°C to -40°C, from ground to cruising altitude within a few minutes. Hence the design should meet the thermal requirements of the electronics inside the packaging adequately, for both the positive and negative extremities of the temperature, so that device limiting temperatures are not exceeded. At the same time, it must accommodate the necessary circuitry. Details of the thermal and mechanical design and performance of the MOPS unit at various altitudes, hot spot location, flow requirements and optimal heat sink design are presented in this paper.