As the mainstream technology of the next generation chip design, to ensure the information security of three dimensional integrated circuits (3DIC) is very necessary, however, the existing hardware security technology is still not suitable for 3DIC’s unique stack structure and interconnection technology. This paper proposes a novel Physical Unclonable Functions (PUF) circuit technology based on 3DIC. The new scheme exploits the process variation of both CMOS devices and TSVs (Through Silicon Vias) available on TSV-based 3DIC, for secure data generation resistant to physical attacks. In the six layers of the 3DIC, the TSV-based ring oscillator PUF Circuit and independent arbiter PUF circuit are designed. The TSV is introduced as additional sources of process variation, and the same 100 3DIC-PUF chips are simulated through HSPICE under the process variation pre-set. The simulation results show that the TSV-based PUF circuit has good unique and reliability, and can be directly applied to the field of 3DIC security authentication.
展开▼
