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首页> 外文期刊>Advances in Science, Technology and Engineering Systems >Comparison of the RC-Triggered MOSFET-Based ESD Clamp Circuits for an Ultra-low Power Sensor System
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Comparison of the RC-Triggered MOSFET-Based ESD Clamp Circuits for an Ultra-low Power Sensor System

机译:基于RC触发MOSFET的ESD钳位电路对超低功耗传感器系统的比较

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摘要

This paper uses the RC-triggered MOSFET-based electrostatic discharge (ESD) power clamp to conduct ESD from ESD events and not affect the ultra-low power sensor system. Then using the stacked device include stacked MOSFET or stacked BJT to reduce the leakage current which increases with temperature. Moreover, we compare gate-driven method and two-level–driven with both gate-driven and substrate-driven methods to determine the most efficient method in terms of layout area, leakage current, Human Body Model (HBM)/Machine Model (MM), and turn-on time. The proposed design of the power ESD clamp (IO15c/IO15e/IO15c_resize) has an HBM ESD protection level with a Positive higher than 8KV, 5.5KV, 8KV, and an MM ESD protection level with a Positive higher than 600V, 300V, 1000V. The power ESD clamp (IO15c/IO15e) consumes nearly 3.5pW/16.45nW and 2.8pW/16.89nW at temperatures of 25°C and 125°C, respectively, when AVDD3 is 1.0V.
机译:本文采用RC触发的基于MOSFET的静电放电(ESD)功率钳位从ESD事件中进行ESD,而不会影响超低功率传感器系统。然后使用堆叠设备包括堆叠的MOSFET或堆叠的BJT,以减小随温度增加的漏电流。此外,我们比较栅极驱动的方法和两级驱动的双栅极驱动和基板驱动的方法,以确定布局区域,漏电流,人体模型(HBM)/机器模型(MM )和接通时间。该电源ESD钳位(IO15C / IO15E / IO15C_Resize)的建议设计具有HBM ESD保护水平,正为高于8kV,5.5kV,8kV和MM ESD保护水平,正为600V,300V,1000V。当AVDD3为1.0V时,电源ESD钳位(IO15C / IO15E)分别消耗近3.5pW / 16.45NW和2.8PW / 16.89NW的温度为25°C和125°C的温度。

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