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Comparison of Thermal Detector Arrays for Off-Axis THz Holography and Real-Time THz Imaging

机译:用于离轴太赫兹全息和实时太赫兹成像的热探测器阵列的比较

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In terahertz (THz) materials science, imaging by scanning prevails when low power THz sources are used. However, the application of array detectors operating with high power THz sources is increasingly reported. We compare the imaging properties of four different array detectors that are able to record THz radiation directly. Two micro-bolometer arrays are designed for infrared imaging in the 8–14 μm wavelength range, but are based on different absorber materials (i) vanadium oxide; (ii) amorphous silicon; (iii) a micro-bolometer array optimized for recording THz radiation based on silicon nitride; and (iv) a pyroelectric array detector for THz beam profile measurements. THz wavelengths of 96.5 μm, 118.8 μm, and 393.6 μm from a powerful far infrared laser were used to assess the technical performance in terms of signal to noise ratio, detector response and detectivity. The usefulness of the detectors for beam profiling and digital holography is assessed. Finally, the potential and limitation for real-time digital holography are discussed.
机译:在太赫兹(THz)材料科学中,当使用低功率THz源时,通常通过扫描成像。然而,越来越多地报道了以高功率太赫兹源工作的阵列检测器的应用。我们比较了能够​​直接记录THz辐射的四个不同阵列探测器的成像特性。两个微辐射热计阵列设计用于在8–14μm波长范围内进行红外成像,但是基于不同的吸收材料(i)氧化钒; (ii)非晶硅; (iii)优化的微辐射热计阵列,用于记录基于氮化硅的太赫兹辐射; (iv)用于太赫兹光束轮廓测量的热电阵列检测器。来自功能强大的远红外激光器的THz波长分别为96.5μm,118.8μm和393.6μm,用于评估信噪比,检测器响应和检测能力方面的技术性能。评估了探测器在光束轮廓分析和数字全息术中的有用性。最后,讨论了实时数字全息术的潜力和局限性。

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