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Optimal and Robust Design Method for Two-Chip Out-of-Plane Microaccelerometers

机译:两芯片面外微加速度计的最优鲁棒设计方法

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In this paper, an optimal and robust design method to implement a two-chip out-of-plane microaccelerometer system is presented. The two-chip microsystem consists of a MEMS chip for sensing the external acceleration and a CMOS chip for signal processing. An optimized design method to determine the device thickness, the sacrificial gap, and the vertical gap length of the M EMS sensing element is applied to minimize the fundamental noise level and also to achieve the robustness to the fabrication variations. In order to cancel out the offset and gain variations due to parasitic capacitances and process variations, a digitally trimmable architecture consisting of an 11 bit capacitor array is adopted in the analog front-end of the CMOS capacitive readout circuit. The out-of-plane microaccelerometer has the scale factor of 372 mV/g∼389 mV/g, the output nonlinearity of 0.43% FSO∼0.60% FSO, the input range of ±2 g and a bias instability of 122 μg∼229 μg. The signal-to-noise ratio and the noise equivalent resolution are measured to be 74.00 dB∼75.23 dB and 180 μg/rtHz∼190 μg/rtHz, respectively. The in-plane cross-axis sensitivities are measured to be 1.1%∼1.9% and 0.3%∼0.7% of the out-of-plane sensitivity, respectively. The results show that the optimal and robust design method for the MEMS sensing element and the highly trimmable capacity of the CMOS capacitive readout circuit are suitable to enhance the die-to-die uniformity of the packaged microsystem, without compromising the performance characteristics.
机译:本文提出了一种实现两芯片平面外微加速度计系统的最优且鲁棒的设计方法。该两芯片微系统由用于感测外部加速度的MEMS芯片和用于信号处理的CMOS芯片组成。一种确定M EMS感应元件的器件厚度,牺牲间隙和垂直间隙长度的优化设计方法被应用来最小化基本噪声水平,并实现对制造变化的鲁棒性。为了消除由于寄生电容和工艺变化引起的失调和增益变化,在CMOS电容读出电路的模拟前端采用了由11位电容器阵列组成的数字可微调架构。平面外微加速度计的比例因子为372 mV / g〜389 mV / g,输出非线性为0.43%FSO〜0.60%FSO,输入范围为±2 g,偏置不稳定性为122μg〜229微克测得的信噪比和噪声等效分辨率分别为74.00 dB〜75.23 dB和180μg/ rtHz〜190μg/ rtHz。测得的面内横轴灵敏度分别为面外灵敏度的1.1%〜1.9%和0.3%〜0.7%。结果表明,针对MEMS传感元件的最佳而稳健的设计方法以及CMOS电容式读出电路的高度可调整的容量适合于在不影响性能的前提下增强封装微系统的芯片间一致性。

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