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CMOS Image Sensor with a Built-in Lane Detector

机译:内置车道检测器的CMOS图像传感器

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This work develops a new current-mode mixed signal Complementary Metal-Oxide-Semiconductor (CMOS) imager, which can capture images and simultaneously produce vehicle lane maps. The adopted lane detection algorithm, which was modified to be compatible with hardware requirements, can achieve a high recognition rate of up to approximately 96% under various weather conditions. Instead of a Personal Computer (PC) based system or embedded platform system equipped with expensive high performance chip of Reduced Instruction Set Computer (RISC) or Digital Signal Processor (DSP), the proposed imager, without extra Analog to Digital Converter (ADC) circuits to transform signals, is a compact, lower cost key-component chip. It is also an innovative component device that can be integrated into intelligent automotive lane departure systems. The chip size is 2,191.4 × 2,389.8 μm, and the package uses 40 pin Dual-In-Package (DIP). The pixel cell size is 18.45 × 21.8 μm and the core size of photodiode is 12.45 × 9.6 μm; the resulting fill factor is 29.7%.
机译:这项工作开发了一种新的电流模式混合信号互补金属氧化物半导体(CMOS)成像器,该成像器可以捕获图像并同时生成车辆车道图。所采用的车道检测算法经过修改以与硬件要求兼容,在各种天气条件下都可以实现高达约96%的高识别率。取代配备了精简指令集计算机(RISC)或数字信号处理器(DSP)的昂贵高性能芯片的基于个人计算机(PC)的系统或嵌入式平台系统,所提出的成像器无需额外的模数转换器(ADC)电路用于转换信号的是一种紧凑,成本较低的关键组件芯片。这也是一种创新的组件设备,可以集成到智能汽车车道偏离系统中。芯片尺寸为2,191.4×2,389.8μm,该封装使用40引脚双封装(DIP)。像素单元尺寸为18.45×21.8μm,光电二极管的核心尺寸为12.45×9.6μm;结果填充因子为29.7%。

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