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Copper Reduction and Contact Killing of Bacteria by Iron Surfaces

机译:铁表面铜的还原和细菌的接触杀灭

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The well-established killing of bacteria by copper surfaces, also called contact killing, is currently believed to be a combined effect of bacterial contact with the copper surface and the dissolution of copper, resulting in lethal bacterial damage. Iron can similarly be released in ionic form from iron surfaces and would thus be expected to also exhibit contact killing, although essentially no contact killing is observed by iron surfaces. However, we show here that the exposure of bacteria to iron surfaces in the presence of copper ions results in efficient contact killing. The process involves reduction of Cu~(2+) to Cu~(+) by iron; Cu~(+) has been shown to be considerably more toxic to cells than Cu~(2+). The specific Cu~(+) chelator, bicinchoninic acid, suppresses contact killing by chelating the Cu~(+) ions. These findings underline the importance of Cu~(+) ions in the contact killing process and infer that iron-based alloys containing copper could provide novel antimicrobial materials.
机译:目前认为,通过铜表面建立良好的细菌杀灭作用(也称为接触杀灭)是细菌与铜表面接触和铜溶解的综合作用,导致致命的细菌破坏。铁可以类似地以离子形式从铁表面释放,因此可以预期也表现出接触杀灭,尽管铁表面基本上没有观察到接触杀灭。但是,我们在这里表明在铜离子存在下细菌暴露于铁表面会导致有效的接触杀灭。该方法包括用铁将Cu〜(2+)还原为Cu〜(+)。已经证明Cu〜(+)对细胞的毒性比Cu〜(2+)大得多。特定的Cu〜(+)螯合剂二辛可宁酸通过螯合Cu〜(+)离子来抑制接触杀伤。这些发现强调了Cu〜(+)离子在接触杀灭过程中的重要性,并推断含铜的铁基合金可以提供新型的抗菌材料。

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