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Facile Preparation of Silver Nanoparticles and Application to Silver Coating Using Latent Reductant from a Silver Carbamate Complex

机译:纳米银的简便制备及其在氨基甲酸酯银络合物中的潜在还原剂在银涂层中的应用

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A low temperature (65 oC) thermal deposition process was developed for depositing a silver coating on thermally sensitive polymeric substrates. This low temperature deposition was achieved by chemical reduction of a silver alkylcarbamate complex with latent reducing agent. The effects of acetol as a latent reducing agent for the silver 2-ethylhexylcarbamate (Ag-EHCB) complex and their blend solutions were investigated in terms of reducing mechanism, and the size and shape of silver nanoparticles (Ag-NPs) as a function of reduced temperature and time, and PVP stabilizer concentration were determined. Low temperature deposition was achieved by combining chemical reduction with thermal heating at 65 oC. A range of polymer film, sheet and molding product was coated with silver at thicknesses of 100 nm. The effect of process parameters and heat treatment on the properties of silver coatings was investigated.
机译:开发了一种低温(65 oC)热沉积工艺,用于在热敏聚合物基材上沉积银涂层。这种低温沉积是通过用潜在的还原剂化学还原烷基氨基甲酸银络合物来实现的。研究了丙酮醇作为2-乙基己基氨基甲酸银(Ag-EHCB)配合物及其共混溶液的潜在还原剂的作用,研究了还原机理,以及银纳米颗粒(Ag-NPs)的尺寸和形状随还原度的变化。降低温度和时间,并确定PVP稳定剂的浓度。通过将化学还原与65 oC的热加热相结合来实现低温沉积。一系列的聚合物薄膜,片材和模塑产品都涂有厚度为100 nm的银。研究了工艺参数和热处理对银涂层性能的影响。

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