Production by Photocurable Resin of Micro Fastener which Realizes Highly Precise Positioning and Conductive Connection of Devices

摘要

As a new implementation method for three-dimensional multi-layering integration, we propose the use of micro fastener, which is produced by the stereolithography using photocurable resin, and can realize precise positioning and conductive connection after plating. The connection does not require strong pressurization and high temperature, that is suitable to low cost production. Because mounting and dismounting is possible, the device is also suitable to small-quantities custom-made production. It also allows easy upgrading. We produced micro fastener experimentally, and demonstrated high conductivity and high strength of the device connection.