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Stability Modification of SPR Silver Nano-Chips by Alkaline Condensation of Aminopropyltriethoxysilane

机译:氨基丙基三乙氧基硅烷的碱性缩合修饰SPR银纳米芯片的稳定性

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The Silver SPR chip was modified by alkaline-silane condensation with aminopropyltriethoxysilane (APTES) in NaOH aqueous solution at different times. Silver sputtered slides coated with APTES were immersed in NaOH solution, enabling us to produce silver surfaces homogeneously covered with APTES. The surface properties of grafted APTES on sputtered silver surface as a occasion of time were studied using SPR analysis, AFM and contact angle measurement. The mechanical and chemical stability of samples was assayed by tape test and NaCl test. The answers show that hydrolysis and condensation of APTES are activated in alkaline solution and lead to formation of a protective APTES layer on the surface of silver. The morphology of APTES on silver surface is a function of coverage density that is altered by changing time. At short times (< 30 min), APTES molecules physically adsorb to the surface leads to weak protection. At higher condensation times, APTES molecules chemically bond to the surface and each other leads to better protection.
机译:通过在不同时间在NaOH水溶液中与氨基丙基三乙氧基硅烷(APTES)进行碱性硅烷缩合来修饰Silver SPR芯片。将涂有APTES的溅射银载玻片浸入NaOH溶液中,使我们能够生产出均匀覆盖有APTES的银表面。使用SPR分析,AFM和接触角测量研究了在一段时间溅射银表面上接枝的APTES的表面性能。样品的机械和化学稳定性通过胶带测试和NaCl测试来测定。答案表明,APTES的水解和缩合在碱性溶液中被激活,并导致在银表面形成保护性APTES层。银表面上APTES的形态是覆盖密度的函数,覆盖密度随时间的变化而改变。在短时间内(<30分钟),APTES分子物理吸附在表面上,导致保护功能弱。在更长的凝结时间,APTES分子化学键合到表面,彼此之间可以提供更好的保护。

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