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High Speed Laser Micro Processing Using High Brilliance Continuous Wave Laser Radiation

机译:高亮度连续波激光辐射的高速激光微加工

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Laser micro processing using a high power single-mode continuous wave fibre laser in combina-tion with a fast galvanometer scanner as well as an ultra fast polygon scan systems was investigated. As a key technology in high rate laser ablation a maximum laser power up to 3 kW and scan speeds up to 18,000 m/min were applied. With the ultra fast laser beam deflection and a small laser focal spot diameter of 21 μm laser dwell times less than 100 nanoseconds were achieved. As a result laser intensities comparable to the q-switched lasers in the range of 108 W/cm2 were irradiated on stain-less steel, copper, and tungsten. The paper discusses the influence of the significant laser processing parameters, such as laser power, scan speed and scan number, on the ablation rate and the machining qualities. Furthermore initial ablation structures and micro-slits will be presented.
机译:研究了使用高功率单模连续波光纤激光器与快速振镜扫描仪以及超快速多边形扫描系统相结合的激光微处理。作为高速率激光烧蚀的关键技术,最大激光功率高达3 kW,扫描速度高达18,000 m / min。通过超快的激光束偏转和21μm的小激光焦点直径,激光驻留时间少于100纳秒。结果,在不沾污的钢,铜和钨上辐照了与q开关激光器相当的激光强度,范围为108 W / cm2。本文讨论了重要的激光加工参数(例如激光功率,扫描速度和扫描次数)对烧蚀速率和加工质量的影响。此外,将介绍初始消融结构和微缝隙。

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