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首页> 外文期刊>Journal of electronics cooling and thermal control >Forced Convection Heat Transfer Coefficient and Pressure Drop of Diamond-Shaped Fin-Array
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Forced Convection Heat Transfer Coefficient and Pressure Drop of Diamond-Shaped Fin-Array

机译:菱形鳍片阵列的强制对流换热系数和压降

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摘要

Forced convection cooling of fins on a high-temperature wall has been used to cool high-power electronic devices. We numerically calculated and experimentally measured the forced convection heat transfer coefficient and pressure drop of a diamond-shaped fin-array with water flow in this study, which had been reported to have a self-induced flip-flop flow phenomenon. Although the flip-flop flow phenomenon occurred in calculations, it was not observed in experiments. The heat transfer and pressure drop of the diamond-shaped fin-array could be estimated with equations for turbulent flow in tubes.
机译:高温壁上的散热片的强制对流冷却已用于冷却大功率电子设备。在本研究中,我们通过数值计算和实验测量了带有水流的菱形鳍状阵列的强制对流传热系数和压降,据报道这具有自感应触发器流现象。尽管在计算中出现了触发器流现象,但在实验中并未观察到。菱形翅片阵列的传热和压降可以通过管中湍流方程来估算。

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