Effect of Fins Arrangement on Thermal Performance in Microelectronics Devices

摘要

Heat sink fins arrangement are important in heat management in microelectronics devices becauseit helps in the dissipation of heat from the chip level device to the environment and provide an efficiently workingdevice. In this light, investigation was conducted on the effect of fins arrangement on thermal performance inmicroelectronics devices using the ANSYS finite element design software. The results obtained showed a maximumtemperature range of between 95.27 – 126.79 oC, thermal resistance of 1.2 – 1.8 K/W, and thermal efficiency of 15 –37%. The results demonstrated that, the arrangement of heat sink fins largely affects the thermal resistances andefficiencies of the microelectronic device. In addition, the A1 rectangular fins arrangement exhibited better thermalcapabilities over the other fins arrangements investigated. This research can aid the development of future heat sinksto accommodate customer demands.