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Effect of Composition, High Magnetic Field and Solidification Parameters on Eutectic Morphology in Cu-Ag Alloys

机译:成分,强磁场和凝固参数对Cu-Ag合金共晶形态的影响

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High magnetic field (HMF) and solidification processes were changed during the solidification of both Cu-28 mass %Ag and Cu-72 mass %Ag alloys. The results indicated that the eutectic morphology in Cu-Ag alloys was affected by HMF, composition and solidification parameters. The lamellar spacing of Cu-28 mass %Ag alloy solidified by furnace-cooling was refined by the application of HMF owing to the decreased diffusion coefficient in mushy zone. The lamellar spacing in both Cu-28 mass %Ag sample held at the eutectic temperature and Cu-72 mass %Ag sample by slow controlling cooling was increased by HMF, which might be attributed to the dominated thermolectromagnetic convection. The lamellar spacing in Cu-72 mass %Ag alloys was increased compared with that of Cu-28 mass %Ag alloys because of the decreased growth rates. In Cu-28 mass %Ag alloy, however, fluid transverse velocity gradient was dominate rather than the growth rate and the imposition of HMF had reverse influences on the lamellar spacing. The lamellar-rod transition of Cu phase was promoted by HMF because of the increased Cu volume fraction in eutectic component. These results shed light on the dependence of eutectic morphology in Cu-Ag alloys on composition, external high magnetic field and solidification parameters.
机译:Cu-28质量%Ag和Cu-72质量%Ag合金的凝固过程中都改变了高磁场(HMF)和凝固过程。结果表明,Cu-Ag合金的共晶形态受HMF,组成和凝固参数的影响。由于在糊状区中扩散系数的降低,通过HMF精炼通过炉冷固化的Cu-28质量%Ag合金的层状间距。保持在低共熔温度下的Cu-28质量%Ag样品和通过缓慢控制冷却的Cu-72质量%Ag样品中的层状间距都通过HMF增大,这可能归因于热电磁对流占主导地位。与Cu-28质量%Ag合金相比,Cu-72质量%Ag合金的层间距增加,这是因为生长速率降低。然而,在Cu-28质量%Ag合金中,流体横向速度梯度是主要因素,而不是生长速度,并且HMF的施加对层状间距有相反的影响。 HMF促进了Cu相的层状棒转变,因为共晶成分中Cu体积分数的增加。这些结果揭示了Cu-Ag合金的共晶形态对成分,外部强磁场和凝固参数的依赖性。

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