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A Simulation Based Development of Process Signatures for Manufacturing Processes with Thermal Loads

机译:基于仿真的热负荷制造过程过程签名开发

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The newly developed concept of Process Signatures enables the comparison of surface integrity achieved by seemingly different manufacturing processes. This paper suggests Process Signatures for grinding and induction heating. Based on finite element simulations of both processes the relevant internal material loads are identified and are correlated with the simulated residual stress state. To provide a comparable simulation approach the moving heat source theory is applied and combined with energetic quantities. The investigations show that grinding and induction heating are similar for certain parameter regimes regarding the generated residual stress state of the workpiece surface layer.
机译:新开发的过程签名概念可以比较表面看似不同的制造过程所获得的表面完整性。本文提出了用于研磨和感应加热的过程签名。基于两个过程的有限元模拟,可以识别相关的内部材料载荷,并将其与模拟的残余应力状态关联。为了提供可比的模拟方法,应用了移动热源理论,并将其与高能量相结合。研究表明,对于工件表面层产生的残余应力状态,在某些参数范围内,磨削和感应加热是相似的。

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