Effects of vibration trajectory on ductile-to-brittle transition in vibration cutting of single crystal silicon using a non-resonant tool

摘要

Vibration-assisted cutting that utilizes a time-varying cutting trajectory has showed superior performance in ductile-mode cutting of various brittle materials, such as glass and cemented carbide. The knowledge regarding the ductile-to-brittle transition condition is a fundamental issue to regulate and ensure high surface integrity in ductile-mode cutting of brittle materials. Specifically, in vibration cutting of brittle materials, the vibration trajectory has a critical influence on the ductile-to-brittle transition. Due to the anisotropy of material property with respect to the cutting direction, the ductile-to-brittle transition of single crystal silicon in vibration cutting is rather complicated. This study focuses on the study of the ductile-to-brittle transition in single crystal silicon considering the effects of the design of tool vibration trajectories. A non-resonant vibration tool thus has been developed to generate various kinds of two-dimensional tool trajectories, such as elliptical and trapezoidal shapes. The effects of trajectory shape on the nominal depth-of-cut are analyzed experimentally in this preliminary study.