One of the advantages of flexible printed circuit (FPC) is that it can keep various shapes due to its highly flexible nature. By using this advantage, the light distribution property can be changed in a light-emitting diode (LED) lighting using LEDs with high directivity. However, the low thermal conductivity of FPC had considerably limited its application to LED lighting. In order to solve this challenge, we developed a high heat diffusion structure that greatly improves FPC's thermal conductivity and a gluing technique that enables 3-dimensional constitution of FPC. Thereby we made it possible to realize an LED module in which the FPC controls light distribution property with high heat diffusion. This newly developed technique is also applicable to high output LED.
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