...
首页> 外文期刊>Scientific Research and Essays >Development and testing of an intelligent hybrid polymeric composite beam embedded with Ni-Ti shape memory alloy with crack growth retarding ability
【24h】

Development and testing of an intelligent hybrid polymeric composite beam embedded with Ni-Ti shape memory alloy with crack growth retarding ability

机译:嵌入Ni-Ti形状记忆合金并具有裂纹扩展抑制能力的智能混合聚合物复合梁的开发与测试

获取原文
   

获取外文期刊封面封底 >>

       

摘要

Hybrid Polymeric Composites (HPC) structural materials pose a challenge of developing microcracks and delaminations under impact and dynamic loads. This paper presents the development and testing of an Intelligent Hybrid Polymeric Composite (IHPC) beam embedded with Ni-Ti Shape Memory Alloy (SMA) with crack growth retarding ability. Upon heating to austenite finish temperature (Af), Ni-Ti SMA wire contracts as a result of detwinned martensite-austenite phase transformation. The contraction of the SMA was utilized to stiffen and retard crack growth in the IHPC beam, hence resulting to an increase of mode I fracture stress intensity factor (KIC). The SMA wire specimens were aged at 250°C, then prestrained at 3% in order to stabilize austenite start (As) and austenite finish (Af)transformation temperatures. The values of Asand Affor Ni-Ti SMA were determined. The IHPC and Polymeric Virgin (PV) notched beams were fabricated from epoxy resin. A four point bending test was performed on the beams to determine the effect of actuated Ni-Ti SMA on mode I fracture stress intensity factor KIC. The test was done at two temperatures, at T1 (below As) and at T2 (Af). Results showed that actuation of the Ni-Ti SMA increased the value of KICfor IHPC beams at T2 by 189% over the value of KICfor PV beams at T1. Actuation of the Ni-Ti SMA increased the value of KICfor IHPC beams at T2 by 41% over the value of KICfor IHPC beams at T1. Results showed that at T1 the loaded PV and IHPC beams fractured with unsteady crack propagation, while at T2 the loaded IHPC beams fractured with steady crack propagation. An increased value of KICand steady crack propagation at T2 indicated that the SMA improved the crack retarding ability of the HPC beam.
机译:混合聚合物复合材料(HPC)结构材料对在冲击和动态载荷下发展微裂纹和分层提出了挑战。本文介绍了嵌入了具有裂纹扩展抑制能力的Ni-Ti形状记忆合金(SMA)的智能混合聚合物复合材料(IHPC)梁的开发和测试。加热至奥氏体终点温度(Af)后,Ni-Ti SMA焊丝由于马氏体-奥氏体相解缠相变而收缩。 SMA的收缩被用来加强和延迟IHPC梁中的裂纹扩展,因此导致I型断裂应力强度因子(KIC)的增加。 SMA线样品在250℃下老化,然后以3%预应变以稳定奥氏体起始(As)和奥氏体完成(Af)的转变温度。确定了Ni-Ti SMA的Asand Af值。 IHPC和Polymer Virgin(PV)缺口梁由环氧树脂制成。对梁进行四点弯曲测试,以确定驱动的Ni-Ti SMA对I型断裂应力强度因子KIC的影响。该测试是在T1(低于As)和T2(Af)两个温度下进行的。结果表明,Ni-Ti SMA的驱动使T2时IHPC光束的KIC值比T1时PV光束的KIC值增加了189%。 Ni-Ti SMA的驱动使T2时IHPC光束的KIC值比T1时IIC的KIC值增加了41%。结果表明,在T1加载的PV和IHPC梁在裂纹扩展不稳定的情况下断裂,而在T2加载的IHPC梁在裂纹扩展稳定的情况下断裂。 KIC值的增加和T2处裂纹的稳定扩展表明SMA改善了HPC梁的抗裂能力。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号