THE ROUGHNESS OF THE COMPOSITE CHIPBOARDS PLATED WITH ALUMINUM FOIL (PAL-Al)

摘要

THIS PAPER PRESENTS THE RESULTS OF A EXPERIMENTAL RESEARCH ON THE ROUGHNESS OF THE COMPOSITE CHIPBOARDS PLATED WITH ALUMINUM FOIL. EXPERIMENTS WERE CONDUCTED IN THE LABORATORY OF TESTING OF THE PROCESSING ACCURACY OF THE FACULTY OF WOOD ENGINEERING, BRASOV. THE ROUGHNESS MEASUREMENT WAS PERFORMED ON THE CHIPBOARD (PAL) WITH FINE FACES, CHIPBOARDS PLATED WITH ALUMINUM FOIL ON BOTH SIDES (PAL-AL) AND ALUMINUM FOIL (FAL). THE STUDY WAS PERFORMED BY MEASURING THE ROUGHNESS THROUGH STYLUS METHOD (BY CONTACT). THE RESULTS OBTAINED HAVE SHOWN THAT THE METHOD WITH CONTACT GIVES MORE ACCURATE DATA, BECAUSE IN THE CASE OF CONTACT LESS METHOD, OCCURS THE REFLECTION PHENOMENON OF THE RADIUS, AND THIS LEADS TO MEASUREMENT ERRORS.