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Interrelation of Solidification Processing Variables and Microstructure of a Horizontally Solidified Al-based 319.1 Alloy

机译:水平凝固Al基319.1合金凝固过程变量与微观组织的相互关系

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In this paper, primary (λ1) and tertiary (λ3) dendritic arm spacings of a ternary Al?–?7wt.% Si?–?3?wt.% Cu alloy casting were characterized and correlated with solidification processing variables: growth rates (VL), cooling rates (TC) as well as local solidification times (tSL). Horizontal directional solidification experiments were carried out under transient heat extraction undergoing cooling rates varying from 0.9 oC/s to 22 oC/s to be associated with samples having quite different microstructural length parameters. Techniques of metallography and optical microscopy were applied in order to have λ1 and λ3 measured. The obtained as-cast microstructures consisted of dendritic α-Al, with Si particles in the aluminum-rich matrix as well distributed along the interdendritic regions in the eutectic mixture interlinked with θ (Al2Cu) intermetallic phase developing the microstructure α-Al + θ + Si. The results showed that power laws –?1.1, –?0 .55 and 0.55 express the variations of both λ1 and λ3 with VL, TC and tSL, respectively, for investigated alloy. A comparative study with the Al?–?3wt.% Cu alloy from literature was also performed and the results show that the growth law of λ1 as a function of TC is represented, for both the investigated alloys, by the mathematical expression given by λ1 = constant (TC)-0.55.DOI: http://dx.doi.org/10.5755/j01.ms.23.2.15768
机译:在本文中,表征了三元Al2〜7wt。%Si3〜3wt。%Cu合金铸件的一次(λ1)和三次(λ3)枝晶臂间距,并与凝固工艺变量相关联:生长速率( VL),冷却速度(TC)以及局部凝固时间(tSL)。水平定向凝固实验是在瞬态热萃取下进行的,冷却速率从0.9 oC / s到22 oC / s不等,与具有微结构长度参数完全不同的样品相关。为了测量λ1和λ3,应用了金相和光学显微镜技术。所获得的铸态显微组织由树枝状α-Al组成,富铝基体中的Si颗粒也沿着与θ(Al2Cu)金属间相互连的共晶混合物中的树枝状区域分布,从而形成了微观结构α-Al+θ+硅。结果表明,对于所研究的合金,幂定律–?1.1,–?0.55和0.55分别表示λ1和λ3随VL,TC和tSL的变化。还对文献中的Al?-?3wt。%Cu合金进行了比较研究,结果表明,对于两种被研究的合金,λ1的生长规律均是TC的函数,由λ1给出的数学表达式表示=常数(TC)-0.55.DOI:http://dx.doi.org/10.5755/j01.ms.23.2.15768

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