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Joining of TiAl to Steel by Diffusion Bonding with Ni/Ti Reactive Multilayers

机译:通过Ni / Ti反应性多层的扩散键合将TiAl连接到钢

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Dissimilar diffusion bonds of TiAl alloy to AISI 310 stainless steel using Ni/Ti reactive multilayers were studied in this investigation. The Ni and Ti alternating layers were deposited by d.c. magnetron sputtering onto the base materials, with a bilayer thickness of 30 and 60 nm. Joining experiments were performed at 700 and 800 °C for 60 min under pressures of 50 and 10 MPa. The effectiveness of using Ni/Ti multilayers to improve the bonding process was assessed by microstructural characterization of the interface and by mechanical tests. Diffusion bonded joints were characterized by scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS), electron backscatter diffraction (EBSD), transmission electron microscopy (TEM) and selected area electron diffraction (SAED), high resolution TEM (HRTEM) and Fast Fourier transform (FFT). The bonding interfaces are thin (approximately 5 μm thick) with a layered microstructure. For all joints, the interface is mainly composed of equiaxed grains of NiTi and NiTi 2 . The thickness and number of layers depends on the joining conditions and bilayer thickness of the multilayers. Mechanical characterization of the joints was performed by nanoindentation and shear tests. Young′s modulus distribution maps highlight the phase differences across the joint′s interface. The highest shear strength value is obtained for the joint produced at 800 °C for 60 min under a pressure of 10 MPa using Ni/Ti multilayers with 30 nm of bilayer thickness.
机译:在本研究中,研究了使用Ni / Ti反应性多层材料的TiAl合金与AISI 310不锈钢的不同扩散键。镍和钛交替层通过直流沉积。磁控管溅射到基材上,双层厚度为30和60 nm。连接实验在50和10 MPa的压力下于700和800°C进行60分钟。通过界面的微结构表征和机械测试,评估了使用Ni / Ti多层膜改善键合过程的有效性。通过扫描电子显微镜(SEM),能量色散X射线光谱(EDS),电子背散射衍射(EBSD),透射电子显微镜(TEM)和选定区域电子衍射(SAED),高分辨率TEM(HRTEM)对扩散键合接头进行了表征)和快速傅立叶变换(FFT)。粘合界面较薄(约5μm厚),具有分层的微结构。对于所有接头,界面主要由NiTi和NiTi 2等轴晶粒组成。层的厚度和数量取决于多层的接合条件和双层厚度。通过纳米压痕和剪切试验对接头进行机械表征。杨氏模量分布图突出显示了整个关节界面的相位差。使用双层厚度为30 nm的Ni / Ti多层膜,在10 MPa的压力下于800℃下60分钟制得的接头可获得最高的剪切强度值。

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