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On the Short Surface Fatigue Crack Growth Behavior in a Fine-Grained WC-Co Cemented Carbide

机译:细晶粒WC-Co硬质合金的短表面疲劳裂纹扩展行为

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In the present study, the fatigue crack growth (FCG) behavior of short surface cracks in a fine-grained cemented carbide with a length of less than 1 mm was investigated. The rotating bending and the four-point bending fatigue tests were carried out at stress ratios of R = ?1 and R = 0.1 ( R = maximum stress/minimum stress). It was found that a short surface crack had a longer stable fatigue crack growth area than a long through-thickness crack; the FCG behaviors of the two types of crack are clearly different. Furthermore, the FCG path of short surface cracks was investigated in detail to study the interaction between fatigue cracks and microstructures of the cemented carbide such as WC grains and the Co phase. At a low K max ( K max = the maximum stress intensity factor), it was found that fatigue crack growth within WC grains is difficult because of a small driving force; instead, crack growth is along the brittle WC/WC interface. On the other hand, at a high K max , WC grain breakage often occurs, since the driving force of FCG is large, and the fatigue crack grows linearly.
机译:在本研究中,研究了长度小于1 mm的细晶粒硬质合金中短表面裂纹的疲劳裂纹扩展(FCG)行为。旋转弯曲和四点弯曲疲劳试验是在应力比R =?1和R = 0.1(R =最大应力/最小应力)下进行的。发现短的表面裂纹比长的全厚度裂纹具有更长的稳定疲劳裂纹扩展区域。两种裂纹的FCG行为明显不同。此外,详细研究了短表面裂纹的FCG路径,以研究疲劳裂纹与硬质合金显微组织(如WC晶粒和Co相)之间的相互作用。发现在低的K max(K max =最大应力强度因子)下,由于驱动力小,WC晶粒内的疲劳裂纹难以生长。相反,裂纹沿着脆性的WC / WC界面生长。另一方面,在K max较高的情况下,由于FCG的驱动力大且疲劳裂纹呈直线状生长,因此经常发生WC晶粒破损。

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