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Material State Awareness for Composites Part I: Precursor Damage Analysis Using Ultrasonic Guided Coda Wave Interferometry (CWI)

机译:复合材料的材料状态感知第I部分:使用超声引导的Coda波干涉法(CWI)的前体损伤分析

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Detection of precursor damage followed by the quantification of the degraded material properties could lead to more accurate progressive failure models for composite materials. However, such information is not readily available. In composite materials, the precursor damages?¢????for example matrix cracking, microcracks, voids, interlaminar pre-delamination crack joining matrix cracks, fiber micro-buckling, local fiber breakage, local debonding, etc.?¢????are insensitive to the low-frequency ultrasonic guided-wave-based online nondestructive evaluation (NDE) or Structural Health Monitoring (SHM) (~100?¢????~500 kHz) systems. Overcoming this barrier, in this article, an online ultrasonic technique is proposed using the coda part of the guided wave signal, which is often neglected. Although the first-arrival wave packets that contain the fundamental guided Lamb wave modes are unaltered, the coda wave packets however carry significant information about the precursor events with predictable phase shifts. The Taylor-series-based modified Coda Wave Interferometry (CWI) technique is proposed to quantify the stretch parameter to compensate the phase shifts in the coda wave as a result of precursor damage in composites. The CWI analysis was performed on five woven composite-fiber-reinforced-laminate specimens, and the precursor events were identified. Next, the precursor damage states were verified using high-frequency Scanning Acoustic Microscopy (SAM) and optical microscopy imaging.
机译:检测前驱物损坏,然后量化降解材料的性能,可能会导致复合材料的更精确的渐进式破坏模型。但是,这种信息并不容易获得。在复合材料中,前体会造成损伤,例如基体开裂,微裂纹,空隙,连接基体裂纹的层间预分层裂纹,纤维微屈曲,局部纤维断裂,局部剥离等。对基于低频超声导波的在线无损评估(NDE)或结构健康监测(SHM)(〜100 ??????? ~~ 500 kHz)系统不敏感。克服这一障碍,在本文中,提出了一种在线超声技术,该技术使用了通常被忽略的导波信号的尾声部分。尽管包含基本导引的兰姆波模式的初到波包未更改,但是尾波包携带有关前体事件的重要信息,并具有可预测的相移。提出了基于泰勒级数的改进的Coda波干涉法(CWI)技术来量化拉伸参数,以补偿由于复合材料前驱物损坏而导致的Coda波相移。在五个编织的复合纤维增强层压板样品上进行了CWI分析,并确定了前体事件。接下来,使用高频扫描声显微镜(SAM)和光学显微镜成像来验证前驱体的损坏状态。

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