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Tantalum Thin Film Applications – A New Approach for Capacitors

机译:钽薄膜应用–电容器的新方法

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摘要

Tantalum-based materials and process developments have increased the use of tantalum films, combined with siliconintegrated circuits, to form hybrid integrated circuits which can meet the demands of telecommunication systems.This paper, after a historical review, describes the status of tantalum thin film technology used at Telettra in theimplementation of circuits for telecommunication equipment. In particular, this paper focusses on the effortsdevoted to the improvement of theβ-Ta capacitor process in terms of yield and reliability forRCactive filterrealization. The results of a new Ta2O5–βTa deposition process, where a Ta2O5layer is first formed by d.c.reactive sputtering in oxygen in the same vacuum batch where theβ-Ta film is sequentially formed, are given.
机译:基于钽的材料和工艺的发展增加了钽膜与硅集成电路的结合使用,形成了可以满足电信系统需求的混合集成电路。本文经过历史回顾,介绍了钽薄膜技术的现状。在Telettra中用于电信设备电路的实现。特别是,本文着重于为实现RC有源滤波器实现良率和可靠性方面致力于改进β-Ta电容器工艺的努力。给出了新的Ta2O5–βTa沉积工艺的结果,其中首先通过在同一真空批次中依次形成β-Ta膜的氧气中的直流反应溅射在氧气中首先形成Ta2O5层。

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