首页> 外文期刊>Electrotehnica, Electronica, Automatica >Aspecte generale ale simul?rii proceselor tehnologice ?n microelectronic? partea IIIGeneral Aspects of Simulation Processes in Microelectronics Part 3Full text in Romanian
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Aspecte generale ale simul?rii proceselor tehnologice ?n microelectronic? partea IIIGeneral Aspects of Simulation Processes in Microelectronics Part 3Full text in Romanian

机译:微电子技术过程仿真的一般方面?第三部分微电子学中模拟过程的一般方面第3部分罗马尼亚语全文

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The paper presents the main aspects of the concept of modelling in microelectronics, as a tool used to describe the electric behaviour of devices and integrated circuits, before their manufacture, or technological processes required for manufacturing, by simulation. They highlight the main stages of technological design, in terms of simulation of a flow sheet: technological process simulation, devices simulation that make up the circuit and circuit simulation. From this point of view, there are three types of models: models of the processes that make up a flow sheet, models describing the electric behaviour of semiconductor devices and integrated circuits. There are exposed, briefly, methods of solving differential equations, with examples of analytical solution (one-dimensional Poisson equation, in the case of ideal MOS structure) and numerical solution (grid generation, discretization of differential equations), exemplifying numerical solving of Poisson equation for electrostatic potential simulation in two-dimensional structure of the MOS transistor. 1D diffusion model is considered for modelling the diffusion of low and high impurities concentration, with an example of solving one-dimensional diffusion equation by finite difference method. It also gives the Newton-Raphson iteration method for linearization of nonlinear algebraic equations, using as an example the semiconductor diode I-V characteristic.
机译:本文介绍了微电子学建模概念的主要方面,它是一种用于通过仿真描述器件和集成电路在制造之前或制造所需的工艺过程中的电气行为的工具。它们通过流程图仿真突出了工艺设计的主要阶段:工艺流程仿真,组成电路的器件仿真和电路仿真。从这个角度来看,存在三种类型的模型:组成流程图的过程模型,描述半导体器件和集成电路电行为的模型。简要介绍了求解微分方程的方法,并举例说明了解析解(一维泊松方程,在理想的MOS结构的情况下)和数值解(网格生成,微分方程的离散化),举例说明了泊松的数值求解MOS晶体管二维结构中静电势模拟的方程。以一维扩散模型为模型,对低浓度和高浓度杂质的扩散进行建模,并以通过有限差分法求解一维扩散方程为例。它还以半导体二极管的I-V特性为例,给出了用于非线性代数方程线性化的Newton-Raphson迭代方法。

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