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A Quick Overview of Compact Air-Cooled Heat Sinks Applicable for Electronic Cooling—Recent Progress

机译:适用于电子冷却的紧凑型空气冷却散热器概述-最新进展

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This study provides an overview regarding enhancement of an air-cooled heat sink applicable for electronic cooling subject to cross-flow forced convection. Some novel designs and associated problems in air-cooled heat sinks are discussed, including the drawback of adding surfaces, utilization of porous surfaces such as metal foam or carbon foam, problems and suitable applicable range of highly interrupted surfaces (louver or slit) and longitudinal vortex generator. Though the metal foam may accommodate significant surface area, it is comparatively ineffective for air-cooling application due to its much lower fin efficiency, and this shortcoming can be improved by integrating with solid fin. For highly dense fin spacing (e.g., 1.0 mm), cannelure or grooved surface may be a better choice, and fin structure with periodic contraction and expansion may not be suitable for it introduces additional pressure drop penalty. The partial bypass concept, which manipulates a larger temperature difference at the trailing part of heat sink, can be implemented to significantly reduce the pressure drop. Through some certain niche operation, t the thermal resistance of the partial bypass heat sink may be superior to the conventional heat sink. The trapezoid fin surface featuring easier manufacturing and a smaller weight is shown to have competitive performance against traditional rectangular fin geometry. The IPFM (Interleaved Parallelogram Fin Module) design which combines two different geometrical fins with the odd number fins being rectangular shape, and parallelogram shape in even fin numbers, shows 8%–12% less surface than conventional design but still offers a lower thermal resistance than the conventional rectangular heat sink in lower flowrate operation. The cross-cut design shows appreciable improvements as compared to the conventional plate fin design especially in high velocity regime and the single cross-cut heat sinks are superior to multiple cross-cut heat sinks.
机译:这项研究概述了适用于经受横流强制对流的电子冷却的风冷散热器的增强。讨论了空气冷却散热器中的一些新颖设计和相关问题,包括添加表面的缺点,使用多孔表面(例如金属泡沫或碳泡沫)的问题,高度中断的表面(百叶窗或狭缝)和纵向的问题和适用范围涡流发生器。尽管金属泡沫可以容纳较大的表面积,但由于其翅片效率低得多,因此在空气冷却应用中相对无效,并且可以通过与固体翅片集成来改善此缺点。对于高度密集的散热片间距(例如<1.0 mm),沟槽或开槽的表面可能是一个更好的选择,周期性收缩和膨胀的散热片结构可能不适合它引入额外的压降损失。可以实施部分旁路概念,该概念可在散热器的尾部操纵较大的温差,以显着降低压降。通过某些特定的利基操作,部分旁路散热器的热阻可能优于常规散热器。梯形鳍片表面易于制造且重量更轻,与传统的矩形鳍片几何形状相比,具有竞争优势。 IPFM(交错式平行四边形翅片模块)设计结合了两个不同的几何翅片,奇数翅片为矩形,而平行四边形为偶数翅片,其表面比传统设计少8%–12%,但仍具有较低的热阻与传统的矩形散热器相比,它在较低的流量下工作。与传统的板翅式设计相比,横切式设计显示出明显的改进,尤其是在高速状态下,并且单个横切式散热器优于多个横切式散热器。

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