...
首页> 外文期刊>ISIJ international >PVD TiN and CrN Coated Austempered Ductile Iron: Analysis of Processing Parameters Influence on Coating Characteristics and Substrate Microstructure
【24h】

PVD TiN and CrN Coated Austempered Ductile Iron: Analysis of Processing Parameters Influence on Coating Characteristics and Substrate Microstructure

机译:PVD TiN和CrN涂层奥氏体球墨铸铁:工艺参数对涂层特性和基体组织的影响分析

获取原文
           

摘要

This work studies the influence of the PVD processing parameters on the characteristics of TiN and CrN coatings deposited on ADI substrates, austempered at 360°C, with different nodule counts and surface roughnesses. Coatings were applied by arc ion plating using an industrial reactor and different sets of parameters, with BIAS voltages, arc currents, chamber pressures and substrate temperatures varying from –100 to –250 V, 60 to 65 A, 0.7 to 2.8 Pa and 280 to 450°C, respectively. The effect of the different depositions conditions on the substrates microstructure was also analyzed. The existing phases, preferred orientation, surface topography, film thickness, hardness and adhesion of each coating were determined. The retained austenite content and hardness of each substrate were computed before and after coating deposition.The results obtained indicate that the different deposition conditions and coating materials evaluated do not generate significant changes neither in the resulting topography nor in the coating adhesion, which can be related to indices between HF1 and HF2. Coating adhesion was not affected by different substrate roughnesses. The combined reduction of BIAS voltage, arc current and chamber pressure leads to a decrease of TiN growth rate and hardness, while high substrate temperatures promotes an increase in TiN and CrN growth rates. Substrate temperatures around 300°C with deposition times of up to 240 min do not promote noticeable changes on the ausferritic microstructure, while temperatures of 400°C and above translate into a clear microstructural deterioration, even for short deposition times.
机译:这项工作研究了PVD处理参数对ADI基底上沉积的TiN和CrN涂层的特性的影响,该基底在360°C的温度下回火,具有不同的结节数和表面粗糙度。使用工业反应器和不同的参数集通过电弧离子镀来涂覆涂层,BIAS电压,电弧电流,腔室压力和基板温度在–100至–250 V,60至65 A,0.7至2.8 Pa和280至280之间变化。分别为450°C。还分析了不同沉积条件对基底微结构的影响。确定每个涂层的现有相,优选的取向,表面形貌,膜厚度,硬度和附着力。计算了涂层沉积前后的残余奥氏体含量和硬度,得出的结果表明,不同的沉积条件和所评估的涂层材料在形貌和涂层附着力方面均未产生显着变化,这可能是相关的。到HF1和HF2之间的索引。涂层附着力不受不同基材粗糙度的影响。 BIAS电压,电弧电流和腔室压力的共同降低导致TiN生长速率和硬度降低,而较高的基板温度则促使TiN和CrN生长速率提高。大约300°C的基板温度和最多240分钟的沉积时间不会促进奥氏体微结构的明显变化,而400°C及更高的温度甚至会在短的沉积时间内转化为明显的微结构劣化。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号