The growth of Lithium Bromide–Water (LiBr–H 2 O) absorption based heat pump is encouraged for the necessity of extracting high heat from the electronic chips. This paper presents a simulation study of single-stage LiBr–H 2 O vapor absorption heat pump for chip cooling. In this study, a detailed thermodynamic analysis of the single-stage LiBr–H 2 O vapor absorption heat pump for chip cooling in the nonexistence of solution heat exchanger was performed and a user-friendly graphical user interface (GUI) package including visual components was developed by using MATlab (2008b). The influence of chip temperature on COP (Coefficient of Performance), flow rates and conductance was examined by using the developed package. The model is validated by using the values available in the literature and indicates that there is a greater reduction in the absorber load. The influence of chip temperature on the performance and thermal loads of individual components was studied and it was concluded that, COP increases from 0.7145 to 0.8421 with an increase in chip temperature.
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