Effect of Thiourea on the Nanocrystalline-Copper Coating Prepared by Jet Electrodeposition

摘要

Jet electrodeposition with the aid of thiourea was proposed in this paper to improve the deposition qualityof copper coatings. The effects of the content in the electrolyte on the coating microstructures,morphologies and mechanical performances were examined. The results show that a densenanocrystalline copper coating is fabricated with 10 mg/L thiourea addition. The average crystal sizeattains 29 nm. The preferred crystal orientation varies from (111) to (220) as the thiourea content in theelectrolyte rises to 10 mg/L from 5 mg/L. The microhardness increases by 81%, and the tensile strengthincreases by 51%, using current density 400 A/dm 2 and at the thiourea concentration 10 mg/L.