Power-and Thermal-aware Mapping for 3D Network-on-chip

摘要

In this study, we present a 3D Network-on-Chip (NoC) comprehensive simulation framework which is integrated with 3D Nirgam, HotSpot and Orion. Based on this framework, a power- and thermal-aware mapping approach for 3D NoC is proposed. The proposed approach uses genetic algorithm to map IP cores onto 3D NoC architecture with the goal of minimizing the power consumption and temperature deviation. Various multimedia benchmark applications are evaluated to confirm the efficiency of the proposed approach. The power consumption in power-aware mapping is saved 27.07% on average compared to random mapping. The temperature deviation between nodes is reduced by 34.56% on average with our approach compared to random mapping while a little influence is caused on performance.