首页> 外文期刊>Indian Journal of Dental Research >Evaluation of microshear bond strength and nanoleakage of etch-and-rinse and self-etch adhesives to dentin pretreated with silver diamine fluoride/potassium iodide: An in vitro study
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Evaluation of microshear bond strength and nanoleakage of etch-and-rinse and self-etch adhesives to dentin pretreated with silver diamine fluoride/potassium iodide: An in vitro study

机译:氟化二胺/碘化钾预处理的牙本质的微剪切粘结强度和蚀刻与冲洗和自蚀刻粘合剂的纳米泄漏评估:一项体外研究

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Aims: The aim of this in vitro study was to comparatively evaluate the microshear bond strength (MSBS) of etch-and-rinse and self-etch (ER and SE) bondingsystems to dentin pretreated with silver diamine fluoride/potassium iodide (SDF/KI) and nanoleakage at the resin-dentin interface using transmission electronmicroscope (TEM). Subjects and Methods: Seventy-two dentin slabs of 3 mm thickness were prepared from extracted human permanent third molars and dividedinto four groups (n = 18) based on the dentin surface treatment as follows: (1) ER adhesive bonding without dentin pretreatment; (2) SDF/KI pretreatment of dentinfollowed by ER adhesive bonding; (3) SE adhesive bonding without dentin pretreatment; and (4) SDF/KI pretreatment of dentin followed by SE adhesive bonding.Resin composite was built on the dentin slabs to a height of 4 mm incrementally, and dentin-composite beams of approximately 1 mm 2 cross-sectional area wereprepared. The beams were subjected to MSBS analysis, and the fractured surface was observed under scanning electron microscope to determine the mode of failure.The resin-dentin interface was examined under TEM for evaluation of nanoleakage. Statistical Analysis Used: One-way ANOVA followed by Tukey?SQ?s posthoc multiple comparison tests. Results: Pretreatment of dentin with SDF/KI increased the MSBS of ER and SE adhesives, though not statistically significant, exceptbetween Groups 2 and 3. In all the groups, the predominant mode of failure was adhesive followed by cohesive in resin, mixed and cohesive in dentin. TEMexamination of resin-dentin interface showed that pretreatment with 38% SDF/KI reduced nanoleakage regardless of the type of bonding system used. Conclusions:Pretreatment of dentin with SDF/KI minimized nanoleakage at the resin-dentin interface without adversely affecting the bond strength of resin composite to dentin.
机译:目的:这项体外研究的目的是比较评估用二胺氟化银/碘化钾(SDF / KI)预处理的蚀刻和冲洗以及自蚀刻(ER和SE)粘合系统对牙本质的微剪切粘合强度(MSBS) )和使用透射电子显微镜(TEM)在树脂-牙本质界面发生纳米泄漏。对象和方法:根据牙本质表面处理方法,从提取的人类永久性第三磨牙制备72块3mm厚的牙本质板,并根据牙本质表面处理将其分为4组(n = 18):(1)未经牙本质预处理的ER粘合剂粘结; (2)ER胶粘接后的牙本质的SDF / KI预处理; (3)SE粘接无需牙本质预处理; (4)对牙本质进行SDF / KI预处理,然后进行SE粘合剂粘结。在牙本质板上将树脂复合材料逐步增加至4mm的高度,并制备横截面积约为1mm 2的牙本质复合梁。对光束进行MSBS分析,并在扫描电子显微镜下观察断裂的表面以确定破坏的方式。在TEM下检查树脂-牙本质界面以评估纳米渗漏性。使用的统计分析:单向方差分析,然后进行Tukey?SQ?的事后多重比较测试。结果:牙本质用SDF / KI预处理可增加ER和SE粘合剂的MSBS,尽管无统计学意义,但第2组和第3组之间除外。在所有组中,主要的破坏方式是粘合剂,然后在树脂中粘结,混合和粘结在牙本质。 TEM-树脂-牙本质界面的检测表明,无论使用何种键合体系,用38%SDF / KI进行的预处理均能减少纳米泄漏。结论:用SDF / KI预处理牙本质可最大程度地减少树脂-牙本质界面的纳米渗漏,而不会不利地影响树脂复合材料与牙本质的粘合强度。

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