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Molecular scale analysis of dry sliding copper asperities

机译:干滑铜粗糙的分子尺度分析

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A fundamental characterization of friction requires an accurate understanding of how the surfaces in contact interact at the nano or atomic scales. In this work, molecular dynamics simulations are used to study friction and deformation in the dry sliding interaction of two hemispherical asperities. The material simulated is copper and the atomic interactions are defined by the embedded atom method potential. The effect of interference, δ , relative sliding velocity, v , asperity size, R , lattice orientation, θ , and temperature control, on the friction characteristics are investigated. Extensive plastic deformation and material transfer between the asperities were observed. The sliding process was dominated by adhesion and resulted in high effective friction coefficient values. The friction force and the effective friction coefficient increased with the interference and asperity size but showed no significant change with an increase in the sliding velocity or with temperature control. The friction characteristics varied strongly with the lattice orientation and an average effective friction coefficient was calculated that compared quantitatively with existing measurements
机译:摩擦的基本特征需要对接触表面如何在纳米或原子尺度上相互作用进行准确的了解。在这项工作中,使用分子动力学模拟来研究两个半球形凹凸的干滑相互作用中的摩擦和变形。模拟的材料是铜,原子相互作用是通过嵌入的原子方法势来定义的。研究了干涉δ,相对滑动速度v,粗糙尺寸R,晶格取向θ和温度控制对摩擦特性的影响。观察到在粗糙之间的广泛的塑性变形和材料转移。滑动过程主要由附着力引起,并导致较高的有效摩擦系数值。摩擦力和有效摩擦系数随过盈量和凹凸尺寸的增加而增加,但随滑动速度的增加或温度控制的变化无明显变化。摩擦特性随晶格取向变化很大,并计算出平均有效摩擦系数,该系数与现有测量值进行了定量比较

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