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An alternative improved method for the homogeneous dispersion of CNTs in Cu matrix for the fabrication of Cu/CNTs composites

机译:碳纳米管在铜基体中均匀分散的另一种改进方法,用于制造铜/碳纳米管复合材料

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Copper has a wide range of applications due to its excellent properties (high thermal and electrical conductivity). Carbon nanotubes (CNTs) are widely used as a reinforcing material due to their superior properties. Copper/Carbon nanotube (Cu/CNTs) composites show enhanced mechanical, electrical and thermal properties as compared to pure Cu and Cu composites. Hence, Cu/CNTs composites have tremendous applications. Cu/CNTs are being developed for use as antifungal and antimicrobial agents, which can lead to their further use in biomedical devices and implant materials. The versatility of this material is such that Cu/CNTs are being developed for use in ultra-large scale integrated circuits for use in the latest integrated circuits and semiconductor chips. The composite material is being used as heat sinks for various industries. Cu/CNTs are now also being employed as catalysts for various industrial reactions. Fuel cell electrodes based on Cu/CNTs are being developed to replace expensive Pt/Pd-based electrodes, currently being used. Another application in the energy sector is the use of Cu/CNTs in direct methanol fuel cells and in methanol gas reforming for H2 production. These extensive applications provided motivation for the current work. However, these applications can only be realized if a stable and uniform Cu/CNTs composite powder can be made. The challenges in fabricating Cu/CNTs composites are: (1) homogeneous dispersion of CNTs in Cu matrix, (2) interfacial bonding between CNTs and Cu matrix and (3) retention of structural integrity of CNTs. Powder metallurgy (PM) has been widely used, but dispersion of Cu/CNTs remains an issue. We employed the molecular level mixing method (MLM), coupled with high energy ball milling (BM) to overcome above mentioned issues. To the best of our knowledge, this is a new process for the homogeneous dispersion of CNTs in copper and has been reported for the first time. To produce a homogenous mixture of Cu and CNTs, a combination of MLM and BM was used in the present work. This method involves using a Cu salt/CNTs mixture in desirable weight ratio (CNTs being were taken in a high concentration), followed by chemical reduction in aqueous medium using NABH4 as reducing agent and EDTA as the oxidation control agent. The resultant mixture (Copper/Carbon nanotube) was mixed with pure Cu using BM. The composites were fabricated using PM, in which the composite powders were first cold pressed at 500–550?MPa followed by sintering at 550–900?°C in a vacuum of 10?2?Torr. Characterization was carried out using SEM, XRD and HRTEM, and various mechanical properties were measured using a Universal testing Instron machine.
机译:铜由于其优异的性能(高导热性和导电性)而具有广泛的应用范围。碳纳米管(CNT)由于其优越的性能而被广泛用作增强材料。与纯铜和铜复合材料相比,铜/碳纳米管(Cu / CNT)复合材料显示出增强的机械,电气和热性能。因此,Cu / CNTs复合材料具有广阔的应用前景。铜/碳纳米管正在开发用作抗真菌剂和抗微生物剂,这可能导致它们进一步用于生物医学设备和植入材料中。这种材料的多功能性使得正在开发将Cu / CNT用于超大规模集成电路中,并将其用于最新的集成电路和半导体芯片中。该复合材料被用作各种行业的散热器。现在,Cu / CNT也被用作各种工业反应的催化剂。正在开发基于Cu / CNT的燃料电池电极来代替当前使用的昂贵的基于Pt / Pd的电极。能源领域的另一个应用是在直接甲醇燃料电池中以及在H 2 生产的甲醇气体重整中使用Cu / CNT。这些广泛的应用为当前的工作提供了动力。但是,只有能够制造出稳定且均匀的Cu / CNTs复合粉末,才能实现这些应用。制造铜/碳纳米管复合材料的挑战是:(1)碳纳米管在铜基体中的均匀分散;(2)碳纳米管与铜基体之间的界面键合;以及(3)保留碳纳米管的结构完整性。粉末冶金(PM)已被广泛使用,但是Cu / CNT的分散仍然是一个问题。我们采用了分子水平混合法(MLM)并结合高能球磨(BM)来克服上述问题。据我们所知,这是一种将CNTs均匀分散在铜中的新工艺,这是首次报道。为了生产铜和碳纳米管的均匀混合物,在本工作中使用了MLM和BM的组合。该方法涉及以理想的重量比使用铜盐/碳纳米管混合物(以高浓度采集碳纳米管),然后使用NABH 4 作为还原剂,EDTA作为氧化控制剂。使用BM将所得混合物(铜/碳纳米管)与纯铜混合。使用PM制造复合材料,其中首先将复合粉末在500-550?MPa下冷压,然后在550-900?C的真空度为10的条件下烧结。 2 ?托。使用SEM,XRD和HRTEM进行表征,并使用通用测试Instron机器测量各种机械性能。

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