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Comparative investigation of Schottky barrier height of Ni-type Ge and Ni-type GeSn

机译:Ni / n型Ge和Ni / n型GeSn的肖特基势垒高度的比较研究

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We report an investigation of the Schottky barrier height (SBH) of Ni-type Ge and Ni-type GeSn films that is annealed at a wide range of temperatures. Both voltage- and temperature-dependent current–voltage (I–V) measurements are performed. From the analysis of these nonlinear I–V traces, the SBH is found and the results shows that the SBH of Ni-type GeSn (a) is smaller than that of Ni-type Ge and (b) decreases with the Sn content of the surface GeSn layer associated with the thermal annealing. By modeling the composition- and strain-dependent energy bandgap (Eg), the relationship between the SBH and Eg is established and it is found that SBH/Eg ~0.8. These results suggest that the GeSn film could serve as an interfacial layer for the reduction of the SBH in Ge-based electronic devices that are desirable for applications.
机译:我们报告了对在宽温度范围内退火的Ni / n型Ge和Ni / n型GeSn薄膜的肖特基势垒高度(SBH)的研究。进行电压和温度相关的电流-电压(IV)测量。通过对这些非线性IV迹线的分析,发现了SBH,结果表明,Ni / n型GeSn的SBH(a)小于Ni / n型GeSn,并且(b)随着表面GeSn层的Sn含量与热退火有关。通过对与组成和应变有关的能带隙(E g )进行建模,建立了SBH与E g 之间的关系,发现SBH / E g 〜0.8。这些结果表明,GeSn膜可以用作界面层,以减少应用中所需的基于Ge的电子器件中的SBH。

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