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On the origin of inter band gap radiative emission in crystalline silicon

机译:关于晶体硅中带隙间辐射发射的起源

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Crystal imperfections degrade the quality of multicrystalline silicon wafers by introducing alternative recombination mechanisms. Here we use non-destructive hyperspectral imaging to detect photoluminescence signals from radiatively active recombination processes over the wafer with a highly resolved spectral third dimension. We demonstrate that band-to-band recombination can be visually separated from recombination through traps across the whole surface of a wafer using hyperspectral imaging. Our samples are studied in the near infrared wavelength region, 900-1700 nm, which includes the region of the so called D-band emission lines. These constitute four resolved emission lines found in the photoluminescencespectrum of silicon, commonly related to recombination through shallow inter-band gap energy levels near the conduction- and valence band edges. The shape and structure of these emissions from our measurements suggest that all the D-lines have different origins.
机译:晶体缺陷通过引入其他复合机制而降低了多晶硅晶片的质量。在这里,我们使用非破坏性的高光谱成像来检测具有高解析光谱三维尺寸的晶圆上的辐射活性复合过程的光致发光信号。我们证明,可以使用高光谱成像技术通过跨整个晶片表面的陷阱,将带间重组从视觉上从重组中分离出来。我们的样本是在900-1700 nm的近红外波长范围内研究的,其中包括所谓的D波段发射线的区域。这些构成了在硅的光致发光光谱中发现的四个分解的发射线,通常与通过导带和价带边缘附近的浅带间隙能级的重组有关。根据我们的测量,这些辐射的形状和结构表明所有D线都有不同的起源。

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