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An improved sodium silicate binder modified by ultra-fine powder materials

机译:一种由超细粉末材料改性的改进的硅酸钠粘合剂

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摘要

This paper presents a new method of modifying sodium silicate binder with ultra-fine powders. Thesodium silicate binder modified by ultra-fine powder A and the organic B can reduce the addition amount of thebinder. The results indicate that the 24 h strength has increased by 39.9% at room temperature and the residualstrength has decreased by 30.7% at 800., compared to the conventional sodium silicate. An available material toimprove the moisture resistance was also found by adding about 2% more inorganic C, and it can increase the moiststrength by 20%. In the end, the microanalyses are given to explain the modifying machanism, i. e., the ultra-finepowder A can refine the sodium silicate binder to avoid holes in the binder bond, which can increase the 24 hstrength at room temperture, and can lead to more cracks in the bond after the molding sand is heated to 800.. Thisis because of the stress caused by the new eutectic complex of modified sodium silicate binder
机译:本文提出了一种用超细粉末改性硅酸钠粘合剂的新方法。用超细粉末A和有机物B改性的硅酸钠粘合剂可以减少粘合剂的添加量。结果表明,与传统的硅酸钠相比,室温下24 h强度提高了39.9%,而800°C下残余强度降低了30.7%。通过添加约2%的无机C,还发现了一种可提高耐湿性的可用材料,它可将湿强度提高20%。最后,给出了微观分析来解释改变机理,即。例如,超细粉A可以精制硅酸钠粘合剂,以避免粘合剂粘结中出现孔洞,这可以增加室温下的24 h强度,并且可以在型砂加热到800后导致粘结中的更多裂纹。这是由于改性硅酸钠粘合剂的新共晶复合物引起的应力

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