Efficient heat conducting liquid metal/CNT pads with thermal interface materials

摘要

Ga-Based thermal interface material (TIM) pads/sheets with high thermal conductivity ($kappa$) are indispensable components in thermal management systems. Here, we present a feasible method to fabricate heat conduction pads, which are composed of carbon nanotubes embedded into a liquid metal (LM). This setup has resulted in a large increase of $kappa$ reaching $sim$14.2 W mK$^{a??1}$, greater than that of most of the commercial thermal silicone pads ($sim$5 W mK$^{a??1}$). In addition, a series of experiments were conducted on smartphones to evaluate the heat dissipation performance of the CPU. It turned out that LManotube pads with TIMs show distinguish thermal conductivity performance.