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首页> 外文期刊>Bulletin of materials science >Surfactant modulated structural modification of hybrid poly($p$-phenylenediamine)/titanium dioxide composites and investigation of their functional behaviour
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Surfactant modulated structural modification of hybrid poly($p$-phenylenediamine)/titanium dioxide composites and investigation of their functional behaviour

机译:聚($ p $-苯二胺)/二氧化钛复合材料的表面活性剂结构改性及其功能性能研究

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摘要

Hybrid polymer materials obtained by combining functional polymers with metal oxides are important functional materials having significant technological implications. Herein, we have described surfactant modulated structural manipulation of hybrid poly($p$-phenylenediamine)/TiO$_2$ composites using oleic acid as the surfactant molecule and investigated functional utility of the polymer composites. Hybrid polymer composites were synthesized by an oxidative polymerization technique using H$_2$O$_2$ as the oxidant and chloroglycinato(1,10-phenanthroline) copper(II) monohydrate as the catalyst. Structural characterization was performed by using conventional techniques like Fourier-transform infrared, ultravioleta??visible spectroscopy, photoluminescence, X-ray diffraction and thermogravimetric analysis. The effect of structural modification on the functional behaviour of the hybrid polymer composites was investigated and important observations were noted. Structural modification of the hybrid polymer composites significantly improved the mechanical and thermal characteristics. Conductivity values obtained from $I$a??$V$ measurement and band gap calculation indicate that there is scope for using such materials as wide band gap semiconductor materials and also as insulator materials.
机译:通过将功能性聚合物与金属氧化物结合而获得的杂化聚合物材料是具有重要技术意义的重要功能性材料。在这里,我们已经描述了使用油酸作为表面活性剂分子的杂化聚($ p $-苯二胺)/ TiO $ _2 $复合材料的表面活性剂调节结构操纵,并研究了聚合物复合材料的功能用途。以H $ _2 $ O $ _2 $为氧化剂,氯甘氨酸为(1,10-菲咯啉)一水合铜(II)为催化剂,通过氧化聚合技术合成了杂化聚合物复合材料。使用常规技术如傅里叶变换红外,紫外可见光谱,光致发光,X射线衍射和热重分析进行结构表征。研究了结构改性对杂化聚合物复合材料功能行为的影响,并注意到了重要的观察结果。杂化聚合物复合材料的结构改性显着改善了机械和热学特性。通过$ I $a≤$ V $测量和带隙计算获得的电导率值表明,存在使用诸如宽带隙半导体材料以及绝缘体材料之类的材料的范围。

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