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Development and optimization of Cu-Zr/Ti cathode for removing copper from contaminated water using electrochemical reduction

机译:电化学还原去除污水中铜的Cu-Zr / Ti阴极的开发与优化

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Consumption of copper contaminated water may lead to adverse health effects, and therefore, it is of utmost importance to remove copper from contaminated streams. More specifically, removing copper from industrial streams, before they enter surface water bodies can reduce anthropogenic copper contamination to a larger extend. This research therefore targeted at optimizing a cathode material and testing the same for employing it in electrochemical copper reduction technology. A Cu-Zr composite coating was developed and optimized on Ti substrate, using electrochemical deposition technique. Coating conditions, including coating current densities and coating durations, were thoroughly investigated. It was found that the best cathode )in terms of electrochemically active surface and stability) can be obtained at copper coating current density of 50 mA/cm(2), copper coating duration of 0.5 h, zirconium coating current density of 75 mA/cm(2), and zirconium coating duration of 1.5 h. A cathode developed with earlier parameters was evaluated using scanning electron microscope coupled with energy dispersive X-ray spectroscopy. The final cathode was successfully employed in removing copper from contaminated water, indicating the ability of using electrochemical reduction technology in removing copper from contaminated streams. About 92% removal of copper from contaminated synthetic wastewater was achieved after 6 h of reaction duration at 10 mA/cm(2) of current density.
机译:消耗被铜污染的水可能导致不利的健康影响,因此,从被污染的溪流中去除铜至关重要。更具体地说,在工业流进入地表水体之前将其除去,可以更大程度地减少人为造成的铜污染。因此,本研究旨在优化阴极材料并对其进行测试,以将其用于电化学铜还原技术。使用电化学沉积技术开发并优化了在Ti基底上的Cu-Zr复合涂层。彻底研究了涂层条件,包括涂层电流密度和涂层持续时间。发现在电化学活性表面和稳定性方面,最好的阴极可以在50 mA / cm(2)的铜涂层电流密度,0.5 h的铜涂层持续时间,75 mA / cm的锆涂层电流密度下获得(2)和锆的涂覆时间为1.5小时。使用扫描电子显微镜和能量色散X射线光谱仪评估了具有较早参数的阴极。最后的阴极已成功用于从污水中去除铜,这表明使用电化学还原技术从污水中去除铜的能力。在电流密度为10 mA / cm(2)的反应持续6小时后,从受污染的合成废水中去除了约92%的铜。

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