The effect of phosphoric acid concentration on resin tag length and bond strength of a photo-cured resin to acid-etched enamel

M.J. Shinchi; K. Soma; N. Nakabayashi

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The effect of phosphoric acid concentration on resin tag length and bond strength of a photo-cured resin to acid-etched enamel

机译：磷酸浓度对光固化树脂与酸蚀搪瓷的树脂标签长度和粘结强度的影响

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Objectives: To determine the relationship between depth of penetration and tensile bond strength of a photo-cured resin to phosphoric acid etched enamel, and the efficacy of enamel etchants that are less aggressive than a concentration of 10/100 H_3PO_4. Methods: The tensile bond strength and length of tags produced by a photo-cured (20 s) resin consisting of pre-polymerized TMPT/silica In 3/100 HNPM-TEGDMA on acid-etched enamel was determined.

机译：目的：确定光固化树脂与磷酸蚀刻的瓷釉的渗透深度与拉伸粘合强度之间的关系，以及腐蚀性低于10/100 H_3PO_4浓度的瓷釉蚀刻剂的功效。方法：测定由酸固化的搪瓷上的3/100 HNPM-TEGDMA中预聚合的TMPT /二氧化硅组成的光固化（20 s）树脂产生的标签的拉伸强度和长度。

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来源
《Dental materials》 |2000年第5期|p.324-329|共6页
作者
M.J. Shinchi; K. Soma; N. Nakabayashi;
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作者单位

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《化学文摘》(CA);
原文格式 PDF
正文语种 eng
中图分类口腔科学;
关键词
Enamel bonding; Phosphoric acid; Etching;

机译：搪瓷粘接;磷酸;刻蚀;
入库时间 2022-08-18 03:47:58

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The effect of phosphoric acid concentration on resin tag length and bond strength of a photo-cured resin to acid-etched enamel

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